Enter – the definitive industry standard for the design and assembly process implementation of BGAs.
Some websites offer a free 10-page "Introduction to IPC-7095." This is not the full standard. It omits the voiding tables and thermal reliability curves. You cannot pass a customer audit with this.
The IPC-7095 standard is the industry’s collective knowledge on BGA and CSP reliability. Whether you are designing a $0.50 Bluetooth module or a $10,000 avionics computer, this document provides the roadmap to success.